The efficacy of Artificial Intelligence (AI) in micro/nano manufacturing is fundamentally constrained by the scarcity of high-quality and physically grounded training data for defect inspection. Lithography defect data from semiconductor industry are rarely accessible for research use, resulting in a shortage of publicly available datasets. To address this bottleneck in lithography, this study proposes a novel methodology for generating large-scale, physically valid defect datasets with pixel-level annotations. The framework begins with the ab initio synthesis of defect layouts using controllable, physics-constrained mathematical morphology operations (erosion and dilation) applied to the original design-level layout. These synthesized layouts, together with their defect-free counterparts, are fabricated into physical samples via high-fidelity digital micromirror device (DMD)-based lithography. Optical micrographs of the synthesized defect samples and their defect-free references are then compared to create consistent defect delineation annotations. Using this methodology, we constructed a comprehensive dataset of 3,530 Optical micrographs containing 13,365 annotated defect instances including four classes: bridge, burr, pinch, and contamination. Each defect instance is annotated with a pixel-accurate segmentation mask, preserving full contour and geometry. The segmentation-based Mask R-CNN achieves AP@0.5 of 0.980, 0.965, and 0.971, compared with 0.740, 0.719, and 0.717 for Faster R-CNN on bridge, burr, and pinch classes, representing a mean AP@0.5 improvement of approximately 34%. For the contamination class, Mask R-CNN achieves an AP@0.5 roughly 42% higher than Faster R-CNN. These consistent gains demonstrate that our proposed methodology to generate defect datasets with pixel-level annotations is feasible for robust AI-based Measurement/Inspection (MI) in semiconductor fabrication.

Deep Learning (DL) models excel in computer vision tasks but can be susceptible to adversarial examples. This paper introduces Triple-Metric EvoAttack (TM-EVO), an efficient algorithm for evaluating the robustness of object-detection DL models against adversarial attacks. TM-EVO utilizes a multi-metric fitness function to guide an evolutionary search efficiently in creating effective adversarial test inputs with minimal perturbations. We evaluate TM-EVO on widely-used object-detection DL models, DETR and Faster R-CNN, and open-source datasets, COCO and KITTI. Our findings reveal that TM-EVO outperforms the state-of-the-art EvoAttack baseline, leading to adversarial tests with less noise while maintaining efficiency.

IBM has released a new free tool designed to help developers cut the chore of labeling images in video when training AI object-detection models. The new auto-labeling tool is part of IBM's push to stay relevant to developers building AI products using the Google-built open-source TensorFlow framework in the IBM Cloud. IBM hopes its auto-labeling tool attracts developers looking to save effort and time when developing new AI applications with TensorFlow. IBM estimates it takes 200 to 500 samples of hand-labeled images for an AI object-recognition model to detect a specific object. The promise is that developers building these models can spend time on more interesting and valuable tasks than labeling objects in video, which is as tedious and as combing through receipts at the end of the month – but also necessary.